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| Job Location | Bangalore |
| Education | Not Mentioned |
| Salary | Not Disclosed |
| Industry | IT - Software |
| Functional Area | Operations Management / Process AnalysisProduction |
| EmploymentType | Full-time |
1. Design of Mechanical package & casing of the Electronic components like IGBT, Processor board, Capacitor etc 2. Benchmarking study of Motor controller mechanical systems 3.Supplier interaction and co-ordiantion with the internal team 4.Supplier visit, Technical evaluation and support to CDMM for development 5.Teamcenter DCRN,Drawing release 6. DFMEA, DFA, DFS documentation 7. Thermal package design and calcualtion along with simulation and develop the casing,
Keyskills :
designdrawingmechanicalasingthermalsupplierautomotive